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Journal description
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Details for article 11 of 16 found articles
| Title: |
Forming mechanism and growth of Kirkendall voids of Sn/Cu joints for electronic packaging: A recent review |
| Author: |
Wang, Jianing Chen, Jieshi Zhang, Lixia Zhang, Zhiyuan Han, Yuzhu Hu, Xiaowu Lu, Hao Zhang, Shuye |
| Appeared in: |
Journal of advanced joining processes |
| Paging: | Volume 6 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 11 of 16 found articles
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