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Journal description
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Details for article 33 of 42 found articles
| Title: |
Shear performance and accelerated reliability of solder interconnects for fan-out wafer-level package |
| Author: |
Zhang, Shuye Duan, Ran Xu, Sunwu Xue, Panfei Wang, Chengqian Chen, Jieshi Paik, Kyung-Wook He, Peng |
| Appeared in: |
Journal of advanced joining processes |
| Paging: | Volume 5 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
The Author(s) |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 33 of 42 found articles
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