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Journal description
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Details for article 35 of 47 found articles
| Title: |
Regulating intermetallic compound growth and bridging in SnAg solder under electromigration stress through Ni addition and sn crystallographic orientation-grain size |
| Author: |
Tran, Dinh-Phuc Xiao, Ya-Ting La, Mai-Phuong Yang, Shi-Chi Chen, Chih |
| Appeared in: |
Journal of advanced joining processes |
| Paging: | Volume 11 () nr. C pages p. |
| Year: |
2025 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 35 of 47 found articles
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