Stacking fault-induced strengthening mechanism in thermoelectric semiconductor Bi2Te3
Titel:
Stacking fault-induced strengthening mechanism in thermoelectric semiconductor Bi2Te3
Auteur:
Huang, Xiege Feng, Xiaobin An, Qi Huang, Ben Zhang, Xiaolian Lu, Zhongtao Li, Guodong Zhai, Pengcheng Duan, Bo Snyder, G. Jeffrey Goddard III,, William A. Zhang, Qingjie