Comprehensive comparative analysis of microstructure of Sn–Ag–Cu (SAC) solder joints by traditional reflow and thermo-compression bonding (TCB) processes
Titel:
Comprehensive comparative analysis of microstructure of Sn–Ag–Cu (SAC) solder joints by traditional reflow and thermo-compression bonding (TCB) processes
Auteur:
Hah, Jinho Kim, Youngja Fernandez-Zelaia, Patxi Hwang, Sungkun Lee, Sangil Christie, Leroy Houston, Paul Melkote, Shreyes Moon, Kyoung-Sik Wong, Ching-Ping