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Journal description
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Details for article 13 of 93 found articles
| Title: |
Comprehensive comparative analysis of microstructure of Sn–Ag–Cu (SAC) solder joints by traditional reflow and thermo-compression bonding (TCB) processes |
| Author: |
Hah, Jinho Kim, Youngja Fernandez-Zelaia, Patxi Hwang, Sungkun Lee, Sangil Christie, Leroy Houston, Paul Melkote, Shreyes Moon, Kyoung-Sik Wong, Ching-Ping |
| Appeared in: |
Materialia |
| Paging: | Volume 6 () nr. C pages p. |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 13 of 93 found articles
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