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Details for article 13 of 34 found articles
| Title: |
Exploring ultrathin tungsten disulfide as a diffusion barrier for copper interconnects: advanced packaging reliability and a first-principles study |
| Author: |
Chavan, Vijay D. Lehenkari, Touko Yadav, Suhas Ustad, Ruhan E. Sheikh, Zulfqar Ali Avatare, Ajay T. Kamble, Tushar P. Sajjad, Laraib Komsa, Hannu-Pekka Sabale, Sandip Choi, Kyeong-Keun Park, Seungbae Dastgeer, Ghulam Kim, Honggyun Kim, Deok-kee |
| Appeared in: |
Materials today nano |
| Paging: | Volume 30 () nr. C pages p. |
| Year: |
2025 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 13 of 34 found articles
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