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Interfacial metallization in segregated structured PEEK composite for enhanced thermal conductivity and electromagnetic interference shielding |
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Titel: |
Interfacial metallization in segregated structured PEEK composite for enhanced thermal conductivity and electromagnetic interference shielding |
Auteur: |
Wang, Yifan Ren, Haicheng Wen, Fengyu Bai, Yageng He, Yashu Cheng, Lin Tan, Haoyuan Ma, Jierun Lian, Pengbo Gu, Yuxuan Chen, Rui Mu, Jianxin |
Verschenen in: |
Materials today nano |
Paginering: |
Jaargang 28 () nr. C pagina's p. |
Jaar: |
2024 |
Inhoud: |
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Uitgever: |
Elsevier Ltd |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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