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Journal description
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Details for article 37 of 78 found articles
| Title: |
Low-dielectric polyimide composite films with enhanced thermal, mechanical, and hydrophobic properties via silica aerogel integration |
| Author: |
Chae, Seung-Hun Noh, Yujin Kim, In-Hee Choi, Hyung-Ho Jeong, Young Gyu |
| Appeared in: |
Surfaces and interfaces |
| Paging: | Volume 69 () nr. C pages p. |
| Year: |
2025 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 37 of 78 found articles
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