Unveiling the uniform copper thickening mechanism of micro through-hole using 4,7,10-trioxa-1,13-tridecanediamine as a novel and single additive in an acidic electroplating bath
Title:
Unveiling the uniform copper thickening mechanism of micro through-hole using 4,7,10-trioxa-1,13-tridecanediamine as a novel and single additive in an acidic electroplating bath