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The differences in bonding properties and electrical, thermal conductivity between the preferred crystallographic orientation interface of Cu3Sn/Cu |
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Titel: |
The differences in bonding properties and electrical, thermal conductivity between the preferred crystallographic orientation interface of Cu3Sn/Cu |
Auteur: |
Chen, Jieshi He, Xiao Hou, Zhixin Wang, Xinyu Shi, Xuerong Ye, Xin Lu, Hao Xiong, Kai Zhang, Shuye |
Verschenen in: |
Surfaces and interfaces |
Paginering: |
Jaargang 46 () nr. C pagina's p. |
Jaar: |
2024 |
Inhoud: |
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Uitgever: |
Elsevier B.V. |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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