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                                       Details for article 144 of 259 found articles
 
 
  Interfacial bonding mechanisms of sintered Cu nanoparticles on different metallization surfaces
 
 
Title: Interfacial bonding mechanisms of sintered Cu nanoparticles on different metallization surfaces
Author: Wu, Yongchao
Zou, Guisheng
Wang, Shuaiqi
Guo, Wei
Zhang, Hongqiang
Liu, Lei
Appeared in: Surfaces and interfaces
Paging: Volume 46 () nr. C pages p.
Year: 2024
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 144 of 259 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands