|
Molecular structure impacts of tetrazole derivatives on their diffusion and adsorption behaviors for microvia copper void-free filling |
|
|
|
Titel: |
Molecular structure impacts of tetrazole derivatives on their diffusion and adsorption behaviors for microvia copper void-free filling |
Auteur: |
Yang, Jia-Qiang Qiu, Jiang-Peng Jin, Lei Wang, Zhao-Yun Song, Tao Zhao, Yi Yang, Xiao-Hui Cheng, Jun Yang, Fang-Zu Zhan, Dong-Ping |
Verschenen in: |
Surfaces and interfaces |
Paginering: |
Jaargang 44 () nr. C pagina's p. |
Jaar: |
2024 |
Inhoud: |
|
Uitgever: |
Elsevier B.V. |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
|
|
|
|