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Journal description
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Details for article 12 of 209 found articles
| Title: |
A novel insight into Au-Au thermosonic flip chip joint under extreme thermal cycles: Defect characterization and failure analysis |
| Author: |
Liu, Jinhong Hua, Yaling Liu, Junfu Paik, Kyung-Wook He, Peng Zhang, Shuye |
| Appeared in: |
Surfaces and interfaces |
| Paging: | Volume 44 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 12 of 209 found articles
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