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Journal description
All volumes of the corresponding journal
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Details for article 94 of 96 found articles
| Title: |
The roles of plasma science towards plasma-activated reflow soldering on Cu substrate with organic solderability preservatives surface finish |
| Author: |
Kencana, Sagung Dewi Kuo, Yu-Lin Yen, Yee-Wen Chuang, Wallace Schellkes, Eckart |
| Appeared in: |
Surfaces and interfaces |
| Paging: | Volume 34 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 94 of 96 found articles
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