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Journal description
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Details for article 49 of 113 found articles
| Title: |
Influence of interfacial structure on bonding strength and thermoelectric transport properties of Cu6Sn5/Cu interface |
| Author: |
Zhang, Zhihang Yang, Qiuguo Huang, Jihua Chen, Shuhai Ye, Zheng Yang, Jian |
| Appeared in: |
Surfaces and interfaces |
| Paging: | Volume 31 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 49 of 113 found articles
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