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Journal description
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Details for article 8 of 137 found articles
| Title: |
A novel diffusion barrier of electrodeposited CoWP layer between copper and silicon: Preparation and performance |
| Author: |
Hu, Zhengyan Ren, Li Zhao, Kangning Wei, Guoying Zhang, Zhongquan Han, Tao Zhong, Fengping Yuan, Meng |
| Appeared in: |
Surfaces and interfaces |
| Paging: | Volume 30 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 8 of 137 found articles
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