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Journal description
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Details for article 47 of 153 found articles
| Title: |
Facilitating low-temperature diffusion bonding between oxygen-free Al2O3 ceramic and pure Cu through inclusion of 0.8 La (wt.%) to Ti pre-metallized interlayer: Microstructural evolution, metallurgical reactions, and mechanical properties |
| Author: |
Lin, Chun-Ming Hsins, Tseng-Pei |
| Appeared in: |
Surfaces and interfaces |
| Paging: | Volume 21 () nr. C pages p. |
| Year: |
2020 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 47 of 153 found articles
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