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Journal description
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Details for article 12 of 133 found articles
| Title: |
Application of 3D electronic speckle pattern interferometry for the analysis of thermal response in printed circuit boards |
| Author: |
Sousa, Pedro J. Carneiro, Fernando Ramos, Nuno Viriato Barros, Francisco Vaz, Mário A.P. Tavares, Paulo J. Moreira, Pedro M.G.P. |
| Appeared in: |
Procedia structural integrity |
| Paging: | Volume 17 (2019) nr. C pages 835-842 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 12 of 133 found articles
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