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HRXRD and micro-CT multiscale investigation of stress and defects induced by a novel packaging design for MEMS sensors |
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Titel: |
HRXRD and micro-CT multiscale investigation of stress and defects induced by a novel packaging design for MEMS sensors |
Auteur: |
Borzì, Aurelio Zboray, Robert Dolabella, Simone Brun, Sébastien Telmont, Florian Kupferschmied, Peter Néal, Jean-François Le Drljaca, Pedrag Fiorucci, Gianni Dommann, Alex Neels, Antonia |
Verschenen in: |
Applied materials today |
Paginering: |
Jaargang 29 () nr. C pagina's p. |
Jaar: |
2022 |
Inhoud: |
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Uitgever: |
The Authors |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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