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Journal description
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Details for article 42 of 261 found articles
| Title: |
Design and characterization of micron-submicron-nano multiscale Ag-Cu solder paste: Sintering bonding process and properties |
| Author: |
Yunqiu, Zhang Canming, Wang Yanping, Wang Baolong, Xue Qiang, Song Xiaojie, Song Lei, Shao |
| Appeared in: |
Materials today communications |
| Paging: | Volume 45 () nr. C pages p. |
| Year: |
2025 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 42 of 261 found articles
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