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Journal description
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Details for article 247 of 261 found articles
| Title: |
Thermal and residual stresses at the EMC-silicon interface: From wafer manufacturing to fracture test |
| Author: |
Videira, Pedro F.C. Akhavan-Safar, Alireza Maleki, Payam Carbas, Ricardo J.C. Marques, Eduardo A.S. Karunamurthy, Bala da Silva, Lucas F.M. |
| Appeared in: |
Materials today communications |
| Paging: | Volume 45 () nr. C pages p. |
| Year: |
2025 |
| Contents: | |
| Publisher: |
The Authors |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 247 of 261 found articles
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