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Journal description
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Details for article 227 of 261 found articles
| Title: |
Study on photothermal dual curing resin used in electronic packaging with inkjet 3D printing |
| Author: |
Sun, Xinyue Zhang, Xiang Lin, Qisen Huang, Yaopeng Xie, Bingbing Ge, Qi Zhu, Jianxiao Wu, Yuanda Li, Qian |
| Appeared in: |
Materials today communications |
| Paging: | Volume 45 () nr. C pages p. |
| Year: |
2025 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 227 of 261 found articles
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