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Journal description
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Details for article 87 of 215 found articles
| Title: |
Fabrication of Sn-plated Cu foam for high-efficiency transient-liquid-phase bonding |
| Author: |
Liu, Jiaxin Lei, Zhenyu Wang, Qing Mou, Yun Chen, Mingxiang |
| Appeared in: |
Materials today communications |
| Paging: | Volume 30 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 87 of 215 found articles
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