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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 172 of 215 found articles
| Title: |
Shear performance of microscale ball grid array structure Cu(Ni)/Sn–3.0Ag–0.5Cu/Cu(Ni) solder joints at low temperatures |
| Author: |
Li, Wangyun Gui, Jun Qin, Hongbo Yang, Daoguo |
| Appeared in: |
Materials today communications |
| Paging: | Volume 30 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 172 of 215 found articles
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