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                                       Details for article 66 of 290 found articles
 
 
  Determining the mechanisms of dissolution and isothermal solidification kinetics during transient liquid phase bonding of commercially pure titanium using a pure copper interlayer
 
 
Title: Determining the mechanisms of dissolution and isothermal solidification kinetics during transient liquid phase bonding of commercially pure titanium using a pure copper interlayer
Author: Tadgell, Colin A.
Corbin, Stephen F.
Appeared in: Materials today communications
Paging: Volume 24 () nr. C pages p.
Year: 2020
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 66 of 290 found articles
 
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