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Journal description
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Details for article 264 of 290 found articles
| Title: |
The effect of Ag on the growth of intermetallics at the interface of Sn5Zn/Cu interconnects |
| Author: |
Guo, Jian Zhao, Xiuchen Liu, Yingxia Tan, Chengwen Liu, Lijun Ning, Xianjin Nie, Zhihua Yu, Xiaodong |
| Appeared in: |
Materials today communications |
| Paging: | Volume 24 () nr. C pages p. |
| Year: |
2020 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 264 of 290 found articles
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