|
Flexible electronics substrate with excellent tear-resistant and high toughness using multi-material 3D printing |
|
|
|
Titel: |
Flexible electronics substrate with excellent tear-resistant and high toughness using multi-material 3D printing |
Auteur: |
Wang, Fei Gao, Zhen-Qiang Feng, Chang-Ping Wang, Dan-Yang Jin, Mao-Peng Zhang, Fan Peng, Zi-Long Zhang, Guang-Ming Zhu, Xiao-Yang Lan, Hong-Bo |
Verschenen in: |
Additive manufacturing |
Paginering: |
Jaargang 81 () nr. C pagina's p. |
Jaar: |
2024 |
Inhoud: |
|
Uitgever: |
Elsevier B.V. |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
|
|
|
|