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                                       Details for article 103 of 119 found articles
 
 
  Subcooled flow boiling in diamond/Cu microchannel heat sinks for near-junction chip cooling
 
 
Title: Subcooled flow boiling in diamond/Cu microchannel heat sinks for near-junction chip cooling
Author: Wu, Nan
Sun, Mingmei
Guo, Hong
Xie, Zhongnan
Du, Shijie
Appeared in: Case studies in thermal engineering
Paging: Volume 69 () nr. C pages p.
Year: 2025
Contents:
Publisher: The Authors
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 103 of 119 found articles
 
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