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                                       Details for article 92 of 175 found articles
 
 
  Implicit modular coupled heat transfer analysis for functionally graded materials using the SVC-FMC method
 
 
Title: Implicit modular coupled heat transfer analysis for functionally graded materials using the SVC-FMC method
Author: Zhu, Ze-Yu
Gao, Bao-Hai
Niu, Zhi-Tian
Ren, Ya-Tao
He, Ming-Jian
Qi, Hong
Appeared in: Case studies in thermal engineering
Paging: Volume 63 () nr. C pages p.
Year: 2024
Contents:
Publisher: The Authors
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 92 of 175 found articles
 
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