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                                       Details for article 219 of 246 found articles
 
 
  Study of heat transfer performance of miniature heat sink for integrated circuit packaging field
 
 
Title: Study of heat transfer performance of miniature heat sink for integrated circuit packaging field
Author: Li, Zhaolong
Li, Wangwang
Liu, Yingtao
Xun, Meng
Yuan, Mengchen
Appeared in: Case studies in thermal engineering
Paging: Volume 49 () nr. C pages p.
Year: 2023
Contents:
Publisher: The Authors
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 219 of 246 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands