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Journal description
All volumes of the corresponding journal
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Details for article 14 of 66 found articles
| Title: |
Development of ultrathin thermal ground plane with multiscale micro/nanostructured wicks |
| Author: |
Yang, Yinchuang Liao, Dong Wang, Hongzhao Qu, Jian Li, Jian Qiu, Huihe |
| Appeared in: |
Case studies in thermal engineering |
| Paging: | Volume 22 () nr. C pages p. |
| Year: |
2020 |
| Contents: | |
| Publisher: |
The Authors |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 14 of 66 found articles
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