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Journal description
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Details for article 55 of 90 found articles
| Title: |
Microstructure Evolution During the Aging at Elevated Temperature of Sn-Ag-Cu Solder Alloys |
| Author: |
Morando, C. Fornaro, O. Garbellini, O. Palacio, H. |
| Appeared in: |
Materials science procedia |
| Paging: | Volume 1 (2012) nr. C pages 7 p. |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 55 of 90 found articles
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