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                                       Details for article 31 of 125 found articles
 
 
  3D CT scan metrology for solder void formation analysis in ball grid array electronic chips
 
 
Title: 3D CT scan metrology for solder void formation analysis in ball grid array electronic chips
Author: Walsh, Karl
Gorji, Nima E.
Appeared in: Results in physics
Paging: Volume 56 () nr. C pages p.
Year: 2024
Contents:
Publisher: The Author(s)
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 31 of 125 found articles
 
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