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Journal description
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Details for article 79 of 286 found articles
| Title: |
Effect of isothermal aging on the microstructure, shear behavior and hardness of the Sn58Bi/Sn3.0Ag0.5Cu/Cu solder joints |
| Author: |
Xu, Ruisheng Liu, Yang Sun, Fenglian |
| Appeared in: |
Results in physics |
| Paging: | Volume 15 () nr. C pages p. |
| Year: |
2019 |
| Contents: | |
| Publisher: |
The Authors |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 79 of 286 found articles
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