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Journal description
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Details for article 108 of 181 found articles
| Title: |
Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates |
| Author: |
Li, Shengli Liu, Yang Zhang, Hao Cai, Hongming Sun, Fenglian Zhang, Guoqi |
| Appeared in: |
Results in physics |
| Paging: | Volume 11 () nr. C pages 617-622 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
The Authors |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 108 of 181 found articles
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