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                                       Details for article 12 of 26 found articles
 
 
  Exploration of bonding phenomenon and microstructural characterization during high-power ultrasonic spot welding of aluminum to steel sheets with copper interlayer
 
 
Title: Exploration of bonding phenomenon and microstructural characterization during high-power ultrasonic spot welding of aluminum to steel sheets with copper interlayer
Author: Satpathy, Mantra Prasad
Patel, Bhanupratap
Sahoo, Susanta Kumar
Appeared in: Ain shams engineering journal
Paging: Volume 10 () nr. 4 pages 811-819
Year: 2019
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 12 of 26 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands