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Direct surface in-situ activation for electroless deposition of robust conductive copper patterns on polyimide film |
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Titel: |
Direct surface in-situ activation for electroless deposition of robust conductive copper patterns on polyimide film |
Auteur: |
Wang, Yuefeng Hong, Yan Chen, Qingguo Zhou, Guoyun He, Wei Gao, Zhengping Zhou, Xin Zhang, Weihua Su, Xinhong Sun, Rui |
Verschenen in: |
Journal of the Taiwan Institute of Chemical Engineers |
Paginering: |
Jaargang 97 (2019) nr. C pagina's 450-457 |
Jaar: |
2019 |
Inhoud: |
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Uitgever: |
Taiwan Institute of Chemical Engineers |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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