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Journal description
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Details for article 29 of 37 found articles
| Title: |
Polymer-based Cu/Ag composite as seed layer on insulating substrate for copper addition of multi-dimensional conductive patterns |
| Author: |
Li, Jiujuan Hong, Yan Zhou, Guoyun Zhang, Huaiwu He, Wei Wang, Shouxu Chen, Yuanming Wang, Chong Su, Xinhong Sun, Yukai Andersson, Martin |
| Appeared in: |
Journal of the Taiwan Institute of Chemical Engineers |
| Paging: | Volume 123 () nr. C pages 254-260 |
| Year: |
2021 |
| Contents: | |
| Publisher: |
Taiwan Institute of Chemical Engineers |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 29 of 37 found articles
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