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Journal description
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Details for article 3 of 11 found articles
| Title: |
EVOLUTION OF MICROSTRUCTURE OF Sn-Ag-Cu LEAD-FREE FLIP CHIP SOLDER JOINTS DURING AGING PROCESS |
| Author: |
Tian, Y.H. Wang, C.Q. Zhou, W.F. |
| Appeared in: |
Acta metallurgica Sinica |
| Paging: | Volume 19 (2006) nr. 4 pages 6 p. |
| Year: |
2006 |
| Contents: | |
| Publisher: |
The Chinese Society for Metals |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 11 found articles
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