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Journal description
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Details for article 28 of 32 found articles
| Title: |
The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates |
| Author: |
Curtulo, Joanisa P. Dias, Marcelino Bertelli, Felipe Silva, Bismarck L. Spinelli, José E. Garcia, Amauri Cheung, Noé |
| Appeared in: |
Journal of manufacturing processes |
| Paging: | Volume 48 () nr. C pages 164-173 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
The Society of Manufacturing Engineers |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 28 of 32 found articles
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