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A simplified and high yield method for Micro-LED integration: Substitution of metal bumps with conductive photoresist in high-precision mass transfer |
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Titel: |
A simplified and high yield method for Micro-LED integration: Substitution of metal bumps with conductive photoresist in high-precision mass transfer |
Auteur: |
Lang, Taifu Zhu, Xueqi Lin, Xin Huang, Xiaowei Xie, Yujie Wang, Shuaishuai Bai, Shuangjia Tang, Xuehuang Li, Jin Yuan, Jiawei Huang, Xinrui Huang, Zhonghang Lin, Chang Sun, Jie Yan, Qun |
Verschenen in: |
Journal of manufacturing processes |
Paginering: |
Jaargang 149 () nr. C pagina's 1166-1177 |
Jaar: |
2025 |
Inhoud: |
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Uitgever: |
The Authors |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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