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Journal description
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Details for article 38 of 116 found articles
| Title: |
Effect of gradient polishing depth on material removal mechanism of silicon wafer polishing by silicon dioxide abrasive based on molecular dynamics |
| Author: |
Le, Jianbo Liu, Juan Mei, Miao Chen, Hu Jiang, Hong Yu, Dongling |
| Appeared in: |
Journal of manufacturing processes |
| Paging: | Volume 141 () nr. C pages 746-759 |
| Year: |
2025 |
| Contents: | |
| Publisher: |
The Society of Manufacturing Engineers |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 38 of 116 found articles
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