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                                       Details for article 22 of 26 found articles
 
 
  Surface modification of polyimide film by coupling reaction for copper metallization
 
 
Title: Surface modification of polyimide film by coupling reaction for copper metallization
Author: Kim, Hwa Jin
Park, Yun Jun
Choi, Jong-Ho
Han, Hak Soo
Hong, Young Taik
Appeared in: Journal of industrial and engineering chemistry
Paging: Volume 15 (2009) nr. 1 pages 8 p.
Year: 2009
Contents:
Publisher: The Korean Society of Industrial and Engineering Chemistry
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 22 of 26 found articles
 
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