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Journal description
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Details for article 55 of 61 found articles
| Title: |
Towards void-free copper filling of low-aspect-ratio heat dissipation through holes in packaging substrate with high H2SO4 concentration electroplating system |
| Author: |
Wang, Zhe Su, Pengfei Peng, Yang Chen, Mingxiang Wang, Qing |
| Appeared in: |
Journal of industrial and engineering chemistry |
| Paging: | Volume 142 () nr. C pages 272-281 |
| Year: |
2025 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 55 of 61 found articles
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