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                                       Details for article 8 of 37 found articles
 
 
  Copper nanoparticles interlocked phase-change microcapsules for thermal buffering in packaging application
 
 
Title: Copper nanoparticles interlocked phase-change microcapsules for thermal buffering in packaging application
Author: Parvate, Sumit
Singh, Jitendra
Reddy Vennapusa, Jagadeeswara
Dixit, Prakhar
Chattopadhyay, Sujay
Appeared in: Journal of industrial and engineering chemistry
Paging: Volume 102 () nr. C pages 69-85
Year: 2021
Contents:
Publisher: The Korean Society of Industrial and Engineering Chemistry
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 8 of 37 found articles
 
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