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Journal description
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Details for article 48 of 56 found articles
| Title: |
Simulation of slurry residence time during chemical-mechanical polishing using 3-D computational fluid dynamics |
| Author: |
Lin, Kuang C. Liao, Chuan-Chieh |
| Appeared in: |
Transactions of the Institution of Chemical Engineers. Part A, Chemical engineering research & design |
| Paging: | Volume 191 () nr. C pages 375-386 |
| Year: |
2023 |
| Contents: | |
| Publisher: |
Institution of Chemical Engineers |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 48 of 56 found articles
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