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Journal description
All volumes of the corresponding journal
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Details for article 145 of 181 found articles
| Title: |
Speed and depth effect of the dipping process for microelectronics packaging |
| Author: |
Huang, Liutian Tian, Qing Xiao, Chengdi Li, Junhui Zhu, Wenhui |
| Appeared in: |
Optik |
| Paging: | Volume 130 (2017) nr. C pages 1285-1294 |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Elsevier GmbH |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 145 of 181 found articles
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