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                                       Details for article 2 of 13 found articles
 
 
  Forensic smartphone analysis using adhesives: Transplantation of Package on Package components
 
 
Title: Forensic smartphone analysis using adhesives: Transplantation of Package on Package components
Author: Heckmann, Th
Markantonakis, K.
Naccache, D.
Souvignet, Th
Appeared in: Digital investigation
Paging: Volume 26 (2018) nr. C pages 29-39
Year: 2018
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 2 of 13 found articles
 
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