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Journal description
All volumes of the corresponding journal
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Details for article 68 of 70 found articles
| Title: |
Thermal parameters optimization of a reflow soldering profile in printed circuit board assembly: A comparative study |
| Author: |
Tsai, Tsung-Nan |
| Appeared in: |
Applied soft computing |
| Paging: | Volume 12 (2012) nr. 8 pages 13 p. |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 68 of 70 found articles
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